The ANSYS Campus Solutions bundle provides access to the majority of offered ANSYS software, including HFSS, Maxwell, SpaceClaim 3D Modeller, IcePak and Fluent/CFX. It provides simulation capabilities for structures, heat transfer, fluid dynamics, explicit dynamics, electromagnetics and multiphysics solvers, ANSYS Workbench, CAD import tools, solid modeling, 3-D full wave electromagnetic fields (frequency and time domain), power and signal integrity, 2/3-D parasitic extraction tools & solvers; high performance shared & distributed memory (HPC) solvers, advanced meshing, and post-processing features. For more information on what is included in this bundle, please refer to the ANSYS Academic Features Product Table at.

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